Methods for substrate orientation
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United States of America Patent
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Jul 18, 2006
Grant Date -
Oct 21, 2004
app pub date -
Apr 18, 2003
filing date -
Apr 18, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Method and apparatus for etching a metal layer disposed on a substrate, such as a photolithographic reticle, are provided. In one aspect, a method is provided for processing a photolithographic reticle including positioning the reticle in a first orientation on a reticle support in a processing chamber, wherein the reticle comprises a metal photomask layer formed on an optically transparent substrate, and a patterned resist material deposited on the metal photomask layer, etching the metal photomask layer in the first orientation, positioning the reticle in at least a second orientation, and etching the metal photomask layer in the at least second orientation.
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