Methods of forming tungsten or tungsten containing films

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20040214417A1
SERIAL NO

10796274

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Abstract

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A method of sputtering a tungsten or tungsten-containing film from a tungsten target onto a semiconductor wafer includes using krypton or xenon as a sputter gas.

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Patent Owner(s)

Patent OwnerAddress
AVIZA TECHNOLOGY LIMITEDCOED RHEDYN RINGLAND WAY NEWPORT GWENT NP18

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Burgess, Stephen Robert Gwent, GB 10 29
O'Sullivan, James Francis Edward Carfiff, GB 1 3
Rich, Paul Glos, GB 18 56
Rimmer, Nicholas Cardiff, GB 3 4

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