Methods of forming tungsten or tungsten containing films

United States of America Patent

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Issued Date
Oct 28, 2004
app pub date
Mar 10, 2004
filing date
Mar 11, 2003

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Abandoned

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Abstract

A method of sputtering a tungsten or tungsten-containing film from a tungsten target onto a semiconductor wafer includes using krypton or xenon as a sputter gas.

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Patent Owner(s)

Patent Owner	Address
AVIZA TECHNOLOGY LIMITED	COED RHEDYN RINGLAND WAY NEWPORT GWENT NP18

International Classification(s)

H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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[Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Burgess, Stephen Robert	Gwent, GB	10	45
O'Sullivan, James Francis Edward	Carfiff, GB	1	5
Rich, Paul	Glos, GB	19	73
Rimmer, Nicholas	Cardiff, GB	3	6

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Methods of forming tungsten or tungsten containing films

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United States of America Patent

10796274

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APP PUB NO	20040214417A1
SERIAL NO	10796274
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10796274

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