Methods of forming tungsten or tungsten containing films

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20040214417A1
SERIAL NO

10796274

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Abstract

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A method of sputtering a tungsten or tungsten-containing film from a tungsten target onto a semiconductor wafer includes using krypton or xenon as a sputter gas.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
AVIZA TECHNOLOGY LIMITEDNEWPORT GWENT29

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Burgess, Stephen Robert Gwent, GB 10 23
O'Sullivan, James Francis Edward Carfiff, GB 1 2
Rich, Paul Glos, GB 18 52
Rimmer, Nicholas Cardiff, GB 3 3

Cited Art Landscape

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (1)
* 5358899 Oxygen assisted ohmic contact formation to n-type gallium arsenide 9 1994
 
ADVANCED MICRO DEVICES, INC. (1)
* 5738917 Process for in-situ deposition of a Ti/TiN/Ti aluminum underlayer 22 1995
 
MCDONNELL DOUGLAS CORPORATION (1)
* 5988488 Process of bonding copper and tungsten 11 1997
 
SONY CORPORATION (1)
* 2004/0238,891 MULTI-LAYERED STRUCTURE FOR FABRICATING AN OHMIC ELECTRODE AND OHMIC ELECTRODE 2 1997
 
SPTS TECHNOLOGIES LIMITED (1)
* 6402907 Method of forming a barrier layer 22 2000
 
MITSUBISHI KASEI CORPORATION (1)
* 5082749 Platinum or palladium/cobalt multilayer on a zinc oxide or indium oxide layer for magneto-optical recording 17 1990
 
BATTELLE MEMORIAL INSTITUTE (1)
* 4786468 Corrosion resistant tantalum and tungsten alloys 9 1987
 
PS4 LUXCO S.A.R.L. (1)
* 6800543 Semiconductor device having a low-resistance gate electrode 12 2002
 
RPX CORPORATION (1)
* 6451690 Method of forming electrode structure and method of fabricating semiconductor device 36 2000
 
Semiconductor Energy Laboratory Co., Ltd. (1)
* 6709902 Semiconductor device and manufacturing method thereof 30 2002
 
APPLIED MATERIALS, INC. (6)
* 5725740 Adhesion layer for tungsten deposition 9 1995
* 6207558 Barrier applications for aluminum planarization 42 1999
* 6200433 IMP technology with heavy gas sputtering 17 1999
* 2003/0022,487 Barrier formation using novel sputter-deposition method 24 2002
* 2003/0196,890 Reducing particle generation during sputter deposition 9 2002
* 7041200 Reducing particle generation during sputter deposition 16 2002
 
RENESAS ELECTRONICS CORPORATION (1)
* 6784038 Process for producing semiconductor integrated circuit device and semiconductor integrated circuit device 3 2001
 
KABUSHIKI KAISHA TOSHIBA (1)
* 5907188 Semiconductor device with conductive oxidation preventing film and method for manufacturing the same 53 1996
 
NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY (2)
* 6960280 Method of forming a surface coating having high surface hardness on a metal, alloy or ceramic substrate 0 2003
* 2003/0150,713 Method of forming a surface coating having high surface hardness on a metal, alloy or ceramic substrate 1 2003
* Cited By Examiner

Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
LAM RESEARCH CORPORATION (1)
* 2016/0035,569 PHYSICAL VAPOR DEPOSITION OF LOW-STRESS NITROGEN-DOPED TUNGSTEN FILMS 1 2014
 
APPLIED MATERIALS, INC. (3)
7790604 Krypton sputtering of thin tungsten layer for integrated circuits 1 2007
8216933 Krypton sputtering of low resistivity tungsten 0 2010
* 2010/0330,795 Krypton Sputtering of Low Resistivity Tungsten 2 2010
* Cited By Examiner