Apparatus to compensate for stress between heat spreader and thermal interface material
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United States of America Patent
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Apr 15, 2008
Grant Date -
Nov 4, 2004
app pub date -
May 28, 2004
filing date -
Sep 27, 2001
priority date (Note) -
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Abstract
A device and method identify and compensate for tensile stress due to heat-caused expansion and contraction between an integrated heat spreader and thermal interface material. This device and method change the shape of the integrated heat spreader based upon the identification of the location of the highest tensile and/or shear stress so that additional thermal interface material is deposited between the integrated heat spreader and a die. Utilizing this method and device, heat is efficiently transferred from the die to the integrated heat spreader.
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