Component and assemblies with ends offset downwardly
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
N/A
Issued Date -
Nov 4, 2004
app pub date -
Feb 27, 2004
filing date -
Feb 27, 2003
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A semiconductor chip package includes a dielectric layer having an attachment portion and an offset portion, off-set downwardly from the attachment portion. A semiconductor chip is mounted to the attachment portion, typically on a bottom or downwardly-facing surface thereof. Terminal structures carried by the offset portion can be bonded to contact pads of a circuit panel by small lands or masses of solder or other bonding material. The package can be thin, and may occupy only a small area of the circuit panel.
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