Method for forming a wafer for use in an optical part
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United States of America Patent
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Feb 5, 2008
Grant Date -
Nov 11, 2004
app pub date -
May 9, 2003
filing date -
May 9, 2003
priority date (Note) -
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status (Latency Note)
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Abstract
An improved method is disclosed, for forming a wafer into a complex, curved shape, for use in an optical part. The method includes a step of moving the wafer into contact with a molding surface having a predetermined non-cylindrical, aspheric curved shape, to form the wafer into a corresponding shape. The step of moving is sufficient, by itself, to form the wafer into the desired non-cylindrical, aspheric curved shape, without the need for additional forming steps.
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