Methods and apparatus for attaching MEMS devices to housing
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United States of America Patent
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Aug 9, 2005
Grant Date -
Nov 11, 2004
app pub date -
May 7, 2003
filing date -
May 7, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method for increasing the bonding strength between a die and a housing for the die is described where a micro-electromechanical system (MEMS) device is formed on the die. The method comprises depositing a plurality of clusters of contact material onto a bottom surface of the housing, placing the die onto the clusters, and subjecting the housing, the clustered contacts, and the die to a thermocompression bonding process.
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