Method of manufacturing an elastomeric heat sink with a pressure sensitive adhesive backing
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United States of America Patent
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Issued Date -
Nov 18, 2004
app pub date -
May 20, 2004
filing date -
Aug 23, 2001
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention discloses method of manufacturing a net-shape molded elastomeric heat-dissipating device that includes an integrally formed conformable interface surface. A base elastomeric matrix material is loaded with thermally conductive filler and injected into a mold cavity to form the completed device. Further, a layer of thermally conductive pressure sensitive adhesive material is applied to the conformable interface surface to allow the device to be securely fastened to a heat-generating surface. The present invention provides superior sealing and elimination of voids and air gaps that are typically found between the thermal transfer surfaces thereby facilitating enhanced thermal transfer properties.
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