Importance

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Abstract

An LED lamp manufacturing process comprising manufacturing a multi-layer printed wiring board having a large number of LED lamp portions, each comprising a depressed portion whose side wall reflects light and has a mounted LED chip sealing resin container function and whose inner bottom has an LED chip mounting pattern, and a terminal pattern which is made conductive with the LED chip mounting pattern and formed on the outer under surface or outer side surface of the depressed portion, mounting predetermined LED chips on the LED chip mounting patterns, sealing the depressed portions with a resin and cutting the board into individual LED lamps, wherein the process comprises: a) preparing a plated through hole printed wiring board (P) having LED chip mounting patterns and terminal patterns formed thereon; b) preparing a through hole formed board (H) having through holes which correspond to the depressed portions and if necessary, have a treated wall to increase reflectance; and c) aligning the through hole formed board (H) with the above plated through hole printed wiring board (P) and bonding them together. According to the present invention, an LED lamp having a greatly increased LED chip mounting space can be manufactured and its assembly work can be simplified. Therefore, the manufacturing process of the present invention has a great industrial value.

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First Claim