Epoxy adhesives and bonded substrates
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United States of America Patent
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Jul 4, 2006
Grant Date -
Nov 25, 2004
app pub date -
May 19, 2003
filing date -
May 19, 2003
priority date (Note) -
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status (Latency Note)
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Abstract
Epoxy adhesives are reported that comprise: (i) about 20% to about 40% weight of a reactive oligomer having a glass transition temperature of about -40.degree. C. or less after curing and having at least two functional groups selected from epoxide, isocyanate, and amine; (ii) an amine curative; and (iii) an epoxide-group containing compound. The epoxy adhesives are resistant to thermal shock and have a low shear creep. The epoxy adhesives are particularly suitable for bonding substrates having mismatched coefficients of thermal expansion.
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