Phenolic resin, epoxy resin, processes for production thereof and epoxy resin composition
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United States of America Patent
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N/A
Issued Date -
Dec 2, 2004
app pub date -
Mar 24, 2004
filing date -
Sep 28, 2001
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
To improve moldability by improving fluidity of resins, and to provide cured substances with favorable heat resistance, relating to the phenol resins and epoxy resins useful as the resins for semiconductor sealing materials. When producing a phenol resin obtained by reacting phenols with dicyclopentadiene in the presence of an acid catalyst, the phenol resin is made to contain in itself specific quantities of the compound A represented by the following general formula (1) and the compound B represented by the following formula (2) by making an aromatic hydrocarbon compound coexist in the phenols at the time of the reaction. 1 (where X means an aromatic hydrocarbon, and R means a proper number of arbitrary atoms or groups.)
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