Method of fabrication of micro-devices
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United States of America Patent
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N/A
Issued Date -
Dec 9, 2004
app pub date -
Apr 9, 2004
filing date -
Oct 25, 2001
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A method of fabricating electromechanical devices such as micro relays on printed circuit boards. The method includes the deposition of an element of the component onto an electrically conducting sacrificial layer, which is subsequently removed to form a PCB component that is suspended above the PCB substrate. In one embodiment, the vias in a multilayer PCB are used as the anchor posts for the suspended component.
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