Remountable connector for land grid array packages
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United States of America Patent
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-
Jul 12, 2005
Grant Date -
Dec 16, 2004
app pub date -
Jun 11, 2003
filing date -
Jun 11, 2003
priority date (Note) -
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status (Latency Note)
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Abstract
A connector for electrically connecting to pads of a land grid array includes a dielectric layer including opposing first and second surfaces, and a multiple number of contact elements formed on the first surface of the dielectric layer. Each contact element includes a base portion of conductive material and an elastic portion of conductive material formed integrally with the base portion. The elastic portion extends from the base portion and protrudes above the first surface of the dielectric layer. Each elastic portion of the multiple number of contact elements elastically engages a respective pad of the land grid array for providing electrical connection to the land grid array. In particular, each elastic portion has an elastic working range on the order of the electrical path length of the contact element.
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