US Patent Application No: 2004/0256,731

Number of patents in Portfolio can not be more than 2000

Dielectric composite material

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ALSO PUBLISHED AS: 7164197
ATTORNEY / AGENT: (SPONSORED)
 

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Abstract

A dielectric composite material containing a toughened benzocyclobutene resin and at least about 50% by weight of an inorganic filler. Also electronic packages having at least one conductive layer and at least one layer of the dielectric composite material. The dielectric composite material can have a dielectric constant less than about 3.5, and a dielectric loss of less than about 0.004.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
3M INNOVATIVE PROPERTIES COMPANYST PAUL, MN7902

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Clough, Robert S - 2 16
Li, Fuming B - 4 27
Mao, Guoping - 5 60
O'Bryan, Nelson B - 2 20
Qu, Shichun - 1 16

Patent Citation Ranking

Forward Cites

Patent Info (Count) # Cites Year
 
MOTOROLA SOLUTIONS, INC. (3)
7,138,068 Printed circuit patterned embedded capacitance layer 1 2005
7,361,568 Embedded capacitors and methods for their fabrication and connection 3 2005
7,605,048 Method for forming a capacitor having a copper electrode and a high surface area aluminum inner layer 0 2007
 
OVID DATA CO. LLC (3)
7,480,152 Thin module system and method 3 2004
7,511,968 Buffered thin module system and method 3 2004
7,616,452 Flex circuit constructions for high capacity circuit module systems and methods 1 2006
 
ENDICOTT INTERCONNECT TECHNOLOGIES, INC. (2)
7,416,996 Method of making circuitized substrate 3 2006
7,508,076 Information handling system including a circuitized substrate having a dielectric layer without continuous fibers 2 2006
 
INTEL CORPORATION (2)
7,335,608 Materials, structures and methods for microelectronic packaging 0 2004
8,129,823 Materials, structures and methods for microelectronic packaging 0 2007
 
ADVANCED SEMICONDUCTOR ENGINEERING, INC. (1)
8,104,171 Method of fabricating multi-layered substrate 0 2008
 
EASTMAN KODAK COMPANY (1)
7,867,688 Laser ablation resist 0 2006
 
ENTORIAN TECHNOLOGIES L.P. (1)
7,324,352 High capacity thin module system and method 20 2005
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (1)
7,930,820 Method for structural enhancement of compression system board connections 1 2005
 
STAKTEK GROUP L.P. (1)
7,626,259 Heat sink for a high capacity thin module system 0 2008
 
WACHOVIA CAPITAL FINANCE CORPORATION ( NEW ENGLAND), AS AGENT (1)
7,078,816 Circuitized substrate 10 2004