Soldering method and apparatus
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Dec 30, 2004
app pub date -
Mar 26, 2004
filing date -
Mar 27, 2003
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A soldering apparatus includes an inspection station downstream of the soldering station. While a first, soldered board is inspected at the downstream inspection station, a second board is collected from a first conveyor, soldered at the soldering station and returned to the first conveyor. If the first, inspected board fails inspection at the inspection station, the second board is moved to a second, upstream conveyor, so that the first board can be moved back on to the first conveyor for collection and re-soldering. The second board can then be moved forwards for inspection while the first board is being resoldered.
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