Semiconductor device and method of manufacturing same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Jun 14, 2005
Grant Date -
Dec 30, 2004
app pub date -
Jul 19, 2004
filing date -
Mar 17, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of manufacturing a semiconductor device includes providing first pad electrodes for connection to leads and second pad electrodes for an internal interface, over a main surface of a first LSI chip. Third pad electrodes of a second LSI chip and the second pad electrodes of the first LSI chip are respectively electrically connected to one another by wires. Circuits required as for a system LSI, which are not included in the first LSI chip, are placed over the second LSI chip, to implement a desired function used as for a system LSI by the two LSI chips. The plurality of LSI chips are then sealed with a resin.
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