Processing apparatus, method for fabrication of semiconductor device by using the processing apparatus, and semiconductor device fabricated by this method

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20050000943A1
SERIAL NO

10853172

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Abstract

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The processing apparatus in accordance with the present invention comprises an object holding unit for holding a processing object, a tool holding unit for holding a tool for processing the processing object, and a relative movement mechanism for causing relative movement of the processing object held in the object holding unit and the tool held in the tool holding unit, while maintaining contact therebetween. The object holding unit and/or the tool holding unit are composed of a plurality of support plates of almost flat shape having elastic property which are arranged in a row.

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Patent Owner(s)

Patent OwnerAddress
NIKON CORPORATION1-5-20 NISHIOI SHINAGAWA-KU TOKYO 1408601 ?1408601
NIKON TECHNOLOGIES INC3-25 FUTABA 1-CHOME SHINGAWA-KU TOKYO 142-0043

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ito, Akinori Matsudo-shi, JP 50 447
Komatsu, Isao Tokyo, JP 16 35
Sugaya, Isao Kawasaki-shi, JP 53 266

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