Sputter deposition masking and methods
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United States of America Patent
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Issued Date -
Jan 13, 2005
app pub date -
May 7, 2004
filing date -
May 7, 2003
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A masking system and method for attaining uniformity or controlled non-uniformity in thin film coatings among an array of substrates in a sputter deposition system. The masking system includes collimators formed by intersecting blades having non-uniform depth, thickness, and/or spacing. The position of the mask may also be fixed relative to the position of the substrates in the system. The system is particularly suitable for attaining such coatings among an array of non-planar or complex-shaped substrates such as automotive lamps, industrial lamps, or reflectors.
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