Method for defect segmentation in features on semiconductor substrates
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United States of America Patent
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Issued Date -
Jan 13, 2005
app pub date -
Jul 6, 2004
filing date -
Jul 11, 2003
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method for defect segmentation in features on semiconductor substrates is disclosed. After acquisition of an image of a semiconductor substrate, identical features or feature elements are subtracted from one another. The resulting difference function is compared with an upper and a lower threshold in order to identify defects.
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