Method for managing polishing apparatus
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United States of America Patent
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Issued Date -
Jan 20, 2005
app pub date -
Jul 15, 2004
filing date -
Jul 15, 2003
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method for managing a polishing apparatus including downforce detecting means for detecting a downforce applied to a polishing target wafer, includes steps of: calculating a difference between a first downforce detected by the downforce detecting means at a first period at which the polishing apparatus stands by for polishing the wafer, and a second downforce detected by the downforce detecting means at a second period at which the polishing apparatus polishes the wafer, as an actual downforce actually applied to the wafer at the second period; and monitoring the actual downforce.
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