Biocompatible wires and methods of using same to fill bone void
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United States of America Patent
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Issued Date -
Jan 20, 2005
app pub date -
Jul 18, 2003
filing date -
Jul 18, 2003
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Devices, kits, and methods are provided for reducing a bone fracture, e.g., a vertebral compression fracture, is provided. The device comprises a plurality of resilient wires composed of a biocompatible material, such as a biocompatible polymer (e.g., polymethylmethacrylate (PMMA)). The wires can be introduced into the cavity of the bone structure to form a web-like arrangement therein. The web-like arrangement can be stabilized by applying uncured bone cement onto the arrangement to connect the wires at their contacts point. The bone cavity can then be filled with a bone growth enhancing medium.
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