Stabilizer for electroless copper plating solution
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United States of America Patent
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Issued Date -
Jan 27, 2005
app pub date -
Jul 23, 2003
filing date -
Jul 23, 2003
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An improved electroless copper plating bath solution comprising a stabilizer selected from the group consisting of formate salts and formic acid. The addition of the formate salt or formic acid to the plating solution provides increased bath stability at the elevated operating conditions of the plating bath, preventing copper from spontaneously decomposing from the plating solution.
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