Apparatus and method for sensing electromagnetic radiation using a tunable device
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United States of America Patent
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May 27, 2008
Grant Date -
Jan 27, 2005
app pub date -
Apr 9, 2004
filing date -
Apr 11, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method for manufacturing a sensing device, such as a bolometer device or other devices. The method includes providing a substrate, e.g., silicon wafer. The method includes forming a first reflection layer overlying the substrate and forming a first electrode layer overlying the substrate. The method includes forming a sacrificial layer overlying a portion of the first reflection layer and a portion of the first electrode layer. The sacrificial layer is patterned using photolithography techniques. The patterned sacrificial layer corresponds to a cavity region. The method also forms a second electrode layer overlying the sacrificial layer and forms an elastic layer overlying the patterned sacrificial layer. The elastic layer encloses the cavity region corresponding to the patterned sacrificial layer. The method releases the sacrificial layer to form an opening in the cavity region.
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