Method of manufacturing a microphone
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Oct 14, 2008
Issued Date -
N/A
app pub date -
Aug 19, 2004
filing date -
Nov 28, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A silicon condenser microphone package is disclosed. The silicon condenser microphone package comprises a transducer unit, substrate, and a cover. The substrate includes an upper surface having a recess formed therein. The transducer unit is attached to the upper surface of the substrate and overlaps at least a portion of the recess wherein a back volume of the transducer unit is formed between the transducer unit and the substrate. The cover is placed over the transducer unit and includes an aperture.
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