Polishing slurry and method for chemical-mechanical polishing of copper

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United States of America Patent

APP PUB NO 20050022456A1
SERIAL NO

10631698

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Abstract

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The claimed invention involves a novel aqueous polishing slurry for chemical-mechanical polishing that is effective for polishing copper at high polish rates. The aqueous slurry according to the present invention comprises particles of MoO.sub.2 in an oxidizing agent. A method for polishing copper by chemical-mechanical polishing includes contacting copper with a polishing pad and an aqueous slurry comprising particles of MoO.sub.2 in an oxidizing agent.

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Patent Owner(s)

Patent OwnerAddress
CYPRUS AMAX MINERALS COMPANY333 NORTH CENTRAL AVENUE PHOENIX AS 85004

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Babu, S V Potsdam, NY 2 19
Hegde, Sharath Potsdam, NY 16 111
Jha, Sunil Chandra Oro Valley, AZ 17 146

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