Multi-layer electrode and method of forming the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 15, 2008
Grant Date -
Feb 3, 2005
app pub date -
Aug 30, 2004
filing date -
Dec 28, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An interconnect includes an opening formed in a dielectric layer. A conductive barrier is deposited in the opening, over which a first conductive layer is deposited. A conductive oxide is deposited over the first conductive layer, and a second conductive layer, formed from the same material as the first conductive layer, is deposited over the conductive liner.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully