Slurry and method for chemical-mechanical planarization of copper
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United States of America Patent
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app pub date -
May 13, 2004
filing date -
Jul 30, 2003
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Abandoned
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Abstract
The claimed invention involves a novel aqueous slurry for chemical-mechanical planarization that is effective for polishing copper at high polish rates. The aqueous slurry according to the present invention comprises particles of MoO.sub.3 dissolved in an oxidizing agent. A method for polishing copper by chemical-mechanical planarization includes contacting copper with a polishing pad and an aqueous slurry comprising particles of MoO.sub.3 dissolved in an oxidizing agent.
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