System and method for manufacturing embedded conformal electronics

United States of America Patent

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May 4, 2010
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Aug 5, 2003
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Aug 5, 2002

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Abstract

A method for fabricating an electronic device comprises providing a substrate (501), direct writing a functional material by a thermal spray on the substrate (502) and removing a portion of the function material to form the electronic or sensory device (503).

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THE RESEARCH FOUNDATION FOR THE STATE UNIVERSITY OF NEW YORK

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B23K:SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLA....

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Inventor Name	Address	# of filed Patents	Total Citations
Gambino, Richard	Stony Brook, US	5	83
Longtin, Jon	Port Jefferson, US	6	80
Sampath, Sanjay	Setauket, US	21	334

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System and method for manufacturing embedded conformal electronics

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United States of America Patent

10491609

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US Family Size	Non-US Coverage
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DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
May 04, 2010	US,7709766,B2 US7709766B2	GRANTED PATENT AS SECOND PUBLICATION
February 10, 2005	US,20050029236,A1 US20050029236A1	FIRST PUBLISHED PATENT APPLICATION

PATENT NO	7709766
SERIAL NO	10491609
DOCKET NO

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10491609

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