Dual light source machining method and system
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United States of America Patent
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N/A
Issued Date -
N/A
app pub date -
Aug 9, 2004
filing date -
Aug 7, 2003
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Disclosed herein is a system useful for machining a workpiece, and having a first light source to generate a first beam for application to a first portion of the workpiece and ablation thereof, a second light source to generate a second beam for application to a second portion of the workpiece and heating thereof, and a positioning apparatus to direct the first and second beams to the first and second portions of the workpiece, respectively. The first light source may include a machining laser, and the second light source include a softening laser. A method of machining the workpiece includes the steps of removing a first portion of the workpiece by directing the first beam to the workpiece wherein the first beam has an intensity sufficient to ablate material from the workpiece, and heating a second portion of the workpiece to a ductile state by directing the second beam to the workpiece.
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