Semiconductor device structural body and electronic device
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United States of America Patent
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app pub date -
Sep 27, 2004
filing date -
Aug 31, 2001
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A semiconductor device, in which a solder layer bonding chip parts and wiring members are enclosed with the resin layer, and the solder layer is comprised of a compound body in which metal powder is distributed in the matrix metal, is disclosed. When a semiconductor device in which the chip parts are installed in the wiring member with the solders, the soldering part is sealed with the resin is mounted secondly on the external wiring member, the outflow of the solders and the short circuit due to the outflow, the disconnections, and the displacement of the chip parts can be prevented.
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