A process is provided for continuously embossing a pattern onto a surface of a film. The process includes heating a resin material to form a flowable melt; discharging the melt into a first nip, wherein the first nip is an area of contact between an embossing roll and a backside roll; pressing the melt against the embossing roll and the backside roll; and forming a self-supporting film with a surface having an embossed pattern thereon. The embossed roll is heated to a temperature greater than a glass transition temperature of the resin whereas the backside roll is heated to a temperature less than the glass transition temperature of the resin.
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