Method for the inspection of features on semiconductor substrates
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United States of America Patent
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Issued Date -
Feb 10, 2005
app pub date -
Jul 9, 2004
filing date -
Jul 11, 2003
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method for the inspection of features of semiconductor substrates is disclosed. Once an image of a semiconductor substrate has been acquired, ROIs are allocated to pattern elements. Various parameters for evaluation of the acquired image of the semiconductor substrate are assigned to the ROIs. The ROI assigned to one pattern element of the semiconductor substrate is automatically transferred to corresponding pattern elements of the semiconductor substrate in the other elements.
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