Probe card substrate
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United States of America Patent
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N/A
Issued Date -
Feb 17, 2005
app pub date -
Aug 9, 2004
filing date -
Aug 12, 2003
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
It is an object of the present invention to provide a probe card substrate for measuring electrical characteristics of a semiconductor device such as an LSI chip. A probe card substrate comprises a main substrate connected to a measuring device for testing a semiconductor device, a sub substrate on which a contact connected to the semiconductor device is mounted, and a conductive component electrically connecting both, in which the main substrate and the sub substrate are connected to be fixed and electrodes provided on a surface of the main substrate opposed to the sub substrate and electrodes provided on a surface of the sub substrate opposed to the main substrate are electrically connected.
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