Separating plate-composite component for producing printed circuit board components and method for producing a composite component of this type
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United States of America Patent
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Issued Date -
Feb 17, 2005
app pub date -
Oct 12, 2004
filing date -
Nov 14, 2001
priority date (Note) -
Abandoned
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Abstract
A separating plate compound component (1) for producing printed circuit boards by compressing multilayers (2) stacked with at least one such compound component (1), which compound component (1) includes a separating plate (3) between copper foils (5), anti-adhesive layers (6) being arranged on the separating plate (3) between the latter and the copper foils (5).
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