Process for adhesive separation of bonded joints
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United States of America Patent
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Aug 5, 2008
Grant Date -
Feb 24, 2005
app pub date -
Aug 31, 2004
filing date -
Oct 27, 1999
priority date (Note) -
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status (Latency Note)
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Abstract
The reversible separation of bonded joints by applying alternating electromagnetic fields is described. The bonded joint consists of at least one primer layer which contains nanoscale particles which have ferromagnetic, ferrimagnetic, superparamagnetic or piezoelectric properties. As a result of the alternating electromagnetic fields, large amounts of localised heat are produced in the primer layer of the bonded joint. This localised heat input causes, in the case of adjacent thermoplastic adhesive layers, softening of the thermoplastic binder. If thermoset adhesives are adjacent to the boundary layer of the primer, then the cross-linked structure in the binder matrix is broken up due to the high degree of localised warming. In both cases quasi-adhesive substrate separation with a low energy input is enabled as a result of the high localised warming of the boundary layer.
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