Area array type package stack and manufacturing method thereof
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United States of America Patent
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N/A
Issued Date -
Feb 24, 2005
app pub date -
Mar 12, 2004
filing date -
Aug 22, 2003
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A package stack has at least two packages of area array types (AAT), each having connecting pads. A flexible cable having conductive patterns is provided between the AAT packages and electrically connected to the connecting pads of the packages.
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