Method for manufacturing divided waveplate filter
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United States of America Patent
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-
Sep 11, 2012
Grant Date -
Mar 3, 2005
app pub date -
Nov 6, 2003
filing date -
Nov 6, 2002
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An adhesive layer is formed on a substrate by printing such that the adhesive layer has a predetermined pattern. A film having a phase-difference characteristic is bonded thereon to form a divided waveplate material layer. The divided waveplate material layer is divided all at once with cutter blades disposed in a row such that the divided waveplate material layer has the predetermined pattern. Then the divided waveplate material layer remaining on portions to be removed is removed, thereby forming divided waveplates on the substrate such that the divided waveplates have the predetermined pattern.
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