Semiconductor device having transferred integrated circuit
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United States of America Patent
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Jun 12, 2007
Grant Date -
Mar 10, 2005
app pub date -
Dec 22, 2003
filing date -
Dec 27, 2002
priority date (Note) -
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status (Latency Note)
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Abstract
It is an object to provide a semiconductor device integrating various elements without using a semiconductor substrate, and a method of manufacturing the same. According to the present invention, a layer to be separated including an inductor, a capacitor, a resistor element, a TFT element, an embedded wiring and the like, is formed over a substrate, separated from the substrate, and transferred onto a circuit board 100. An electrical conduction with a wiring pattern 114 provided in the circuit board 100 is made by a wire 112 or a solder 107, thereby forming a high frequency module or the like.
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