Heat sink structure
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United States of America Patent
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-
Jan 23, 2007
Grant Date -
Mar 24, 2005
app pub date -
Sep 2, 2004
filing date -
Sep 18, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention provides a heat sink structure, which includes: a housing located on a material with low thermal conductivity; and a heat conductor placed inside the housing. At least one air gap is formed between the heat conductor and the housing to reduce the conductivity from the heat conductor to the housing, and thus increasing the thermal resistance between the heat conductor and the housing. The surface temperature of the bottom of the housing thus could be reduced and averaged, so as to effectively improve the lifespan, the safety and reliability of a device with the heat sink structure.
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