Electrical assemblage and method for removing heat locally generated therefrom
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United States of America Patent
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Apr 19, 2005
Grant Date -
Mar 24, 2005
app pub date -
Dec 23, 2002
filing date -
Dec 23, 2002
priority date (Note) -
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Abstract
A densely packed electronic assemblage has a substrate media for supporting at least one heat generating component and means for reducing the temperature of the at least one heat generating component. A heat sink cooperates with the heat removing element for reducing heat of the at least one heat generating component by absorbing heat from the at least one heat generating component.
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