Low signal loss bonding ply for multilayer circuit boards
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United States of America Patent
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app pub date -
Nov 16, 2004
filing date -
Sep 14, 2001
priority date (Note) -
Abandoned
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Abstract
A low loss circuit board sheet includes a first layer disposed on a second layer. The first layer includes a thermosetting adhesive composition and the second layer is selected from a woven fabric substrate impregnated with at least one rubber, a nonwoven fabric substrate impregnated with at least one rubber and a polymeric film having at least one rubber disposed thereon.
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