Thermosetting resin composition, process for producing the same, and suspension-form mixture
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United States of America Patent
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Issued Date -
Mar 31, 2005
app pub date -
Dec 26, 2002
filing date -
May 25, 2001
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
This invention relates a thermosetting resin composition which is produced by curing a composition containing a thermosetting resin and a reactive mono-olefin polymer, and its phase structure is sea-island structure which comprises a continuous phase mainly composed of a cured composition containing a thermosetting resin and, if necessary, further curing agent and dispersed phases mainly composed of a reactive mono-olefin polymer and said dispersed phases contain a plurality of finer dispersed phases and/or at least one layer of interfacial phases surrounding said dispersed phases, thereby providing a thermosetting resin composition that is suitable for use in sealing or encapsulating semiconductor devices, which composition has improved impact strength, resistance to thermal cracking, resistance to deterioration by oxidation, without losing thermal stability.
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