Chemical-mechanical planarization composition having PVNO and associated method for use
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United States of America Patent
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Issued Date -
Apr 14, 2005
app pub date -
Oct 10, 2003
filing date -
Oct 10, 2003
priority date (Note) -
Abandoned
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Abstract
A composition and associated method for chemical mechanical planarization (or other polishing) are described. The composition comprises an abrasive and a polyvinylpyridine-N-oxide polymer. The composition possesses high selectivities for metal and barrier material removal in metal CMP. The composition may further comprise an oxidizing agent in which case the composition is particularly useful in conjunction with the associated method for metal CMP applications (e.g., copper CMP).
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