Method and apparatus for deflashing of integrated circuit packages
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 30, 2007
Issued Date -
N/A
app pub date -
Jul 29, 2004
filing date -
Oct 1, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
This invention relates to a method and apparatus for deflashing integrated circuit (IC) packages by laser irradiation. The method and apparatus include two lasers scanning flash area for performing deflashing operation. CO.sub.2 laser is used to remove top layer of flash and YAG laser is used to remove the thin layer of flash remained after CO.sub.2 laser deflashing. CO.sub.2 laser deflashing and following YAG laser deflashing can effectively remove flash and avoid damage of heat sinks as well as leads and bars in the IC packages.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully