A coupling and method for forming a hermetic seal between a component and a housing is provided in which a mechanical joint is formed between an exposed interior surface of the component and an exterior surface of a protrusion on the housing. The coefficients of thermal expansion of the connector and the housing are chosen such that the solder joint is in compression during cool down of the solder.
Please note there is up to 60 days of latency in this Status indicator for certain status conditions. You can obtain up-to-date Status indicator readings by ordering PAIR for the file.
An application with the status "Published" (which means it is pending) may be recently abandoned, but not yet updated to reflect its abandoned status. However, an application filed less than one year ago is unlikely to be abandoned.
A patent with the status "Granted" may be recently expired, but not yet updated to reflect its expired status. However, it is highly unlikely a patent less than 3.5 years old would be expired.
An application with the status "Abandoned" is almost always current, but there is a small chance it was recently revived and the status not yet updated.
This priority date is an estimated earliest
priority date and is purely an estimation. This date should not be
taken as legal conclusion. No representations are made as to the
accuracy of the date listed. Please consult a legal professional
before relying on this date.