Coupling and method for producing a hermetic seal
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United States of America Patent
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May 31, 2005
Grant Date -
Apr 21, 2005
app pub date -
Aug 10, 2004
filing date -
Oct 16, 2003
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A coupling and method for forming a hermetic seal between a component and a housing is provided in which a mechanical joint is formed between an exposed interior surface of the component and an exterior surface of a protrusion on the housing. The coefficients of thermal expansion of the connector and the housing are chosen such that the solder joint is in compression during cool down of the solder.
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