Semiconductor wafer location sensing via non contact methods
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United States of America Patent
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Issued Date -
Apr 21, 2005
app pub date -
Sep 15, 2004
filing date -
Sep 19, 2003
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Embodiments of the present invention generally provide accurate spatial determination, in three dimensions, of the wafer location, along with the provision of information about the presence of any error conditions relative to the wafer(s) such as cross slotting or double stacked wafers inside the wafer carrier. A device in accordance with an embodiment of the invention can be used in conjunction with a wafer handling system which requires the measurement of a wafer's location before it can be picked up and passed through a set of processing steps.
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