Method and apparatus for improved electrode plate
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United States of America Patent
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Issued Date -
May 12, 2005
app pub date -
Nov 12, 2003
filing date -
Nov 12, 2003
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An electrode plate, configured to be coupled to an electrode in a plasma processing system, comprises a plurality of gas injection holes configured to receive gas injection devices. The electrode plate comprises three or more mounting holes, wherein the electrode plate is configured to be coupled with an electrode in the plasma processing system by aligning and coupling the three or more mounting holes with three or more mounting screws attached to the electrode.
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