Method for diffusion bond welding for use in a multilayer electronic assembly
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United States of America Patent
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Issued Date -
May 12, 2005
app pub date -
Nov 7, 2003
filing date -
Nov 7, 2003
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention provides a method for forming thermal, mechanical and electrical connections between circuit traces in different layers of a multilayer electronic assembly. The method includes the steps of providing circuit layers with circuit traces of appropriately chosen metal, aligning the layers to form a lay up and exposing the lay up to selected conditions of temperature and pressure, over a period of time, sufficient to fuse the circuit layers to each other and to diffusion bond weld the circuit traces to each other. The present invention also provides a multilayer electronic assembly having circuit trace bonds formed according to the method of the present invention.
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