Polishing pad process for producing the same and method of polishing
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United States of America Patent
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Issued Date -
May 19, 2005
app pub date -
Jun 16, 2004
filing date -
Dec 28, 2001
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
According to the present invention, there is provided a polishing pad for polishing the surface of wafers for creating semiconductor integrated circuits, wherein said pad has a high polishing speed, said polishing is uniform, and said pad has a long life. Preferably, the polishing pad of the present invention comprises nonwoven fabric (base matrix) and a nonporous photo-setting resin that fills the space between the nonwoven fabric, and can be produced by impregnating the base matrix with a photo-sensitive resin composition containing at least one selected from the group consisting of a hydrophilic photopolymeric polymer or oligomer, and/or a hydrophilic photopolymeric monomer, and then photo-setting the same.
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