Surface processing method for a chip device and a chip device formed by he method
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United States of America Patent
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Issued Date -
May 26, 2005
app pub date -
Nov 17, 2004
filing date -
Nov 20, 2003
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A surface processing method for a chip device includes the steps of: (a) providing a chip body having at least one exposed surface; (b) applying a polymeric monomer solution having a plurality of monomers to the at least one surface of the chip body, wherein each of the monomers has a soft fragment fluorocarbon (FC) polymer end and a polar silane group; and (c) curing the polymeric monomer solution to remove solvents out under proper environment settings, and to polymerize the monomers into a solid polymer layer on the at least one surface. The solid polymer layer thus has an exposed surface having a soft fragment FC polymer structure for protecting the chip body from encountering any external or internal interference.
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